Intel Core Ultra 9 285K / 288V / 185H (2025)

Intel Core Ultra 9 285K / 288V / 185H (2025)

The Intel Core Ultra 9 is part of Intel’s Arrow Lake lineup, which introduces a significant shift in their CPU architecture and branding. The Core Ultra series is designed to offer premium performance, targeting high-end users and gamers. The Core Ultra 9 features a hybrid architecture with a mix of performance (P) cores and efficiency (E) cores, enhancing both single-threaded and multi-threaded performance. This CPU is built on Intel’s 7nm process and includes advanced AI processing capabilities, making it a standout in the market.

The Intel Core Ultra 9 series includes several high-performance models designed for both desktop and mobile platforms. Here are some notable models:

Desktop Models:

  • Core Ultra 9 285K: This is a top-tier model with 24 cores (8 performance cores and 16 efficient cores), a base frequency of 3.7 GHz, and a turbo boost up to 5.7 GHz
  • Core Ultra 9 288V: This model features 8 cores and a turbo boost up to 5.1 GHz

Mobile Models:

  • Core Ultra 9 185H: A high-performance mobile processor with 16 cores, a base frequency of 2.3 GHz, and a turbo boost up to 5.1 GHz
    • The “185H” in Intel Core Ultra 9 185H refers to the specific model within the Core Ultra 9 series. Here’s a breakdown of the naming convention:
      1. “1” indicates the generation or series, with “1” representing the first generation of Core Ultra processors.
      2. “85” is a model number that differentiates it from other models within the same series.
      3. “H” denotes that it is a high-performance mobile processor, typically used in laptops designed for demanding tasks

Intel Core Ultra 9 (2025)
Intel Core Ultra 9 (2025)

Intel Core Ultra 9 285K Overview

The Intel Core Ultra 9 285K is a flagship processor from Intel’s 14th Gen Arrow Lake series, designed for high-performance desktop computing. It features a hybrid architecture with 24 cores (8 performance cores and 16 efficient cores) and 24 threads. The performance cores have a base frequency of 3.7 GHz and can boost up to 5.7 GHz, while the efficient cores operate at a base frequency of 3.2 GHz and can boost up to 4.6 GHz.

Hype and Compatibility

The “hype” around the Core Ultra 9 285K stems from its advanced chiplet architecture, which uses TSMC’s 3nm process for the compute tile, promising significant improvements in power efficiency and performance. It is compatible with the new LGA 1851 socket and requires a Z890 chipset motherboard. This processor supports DDR5 memory up to 6400 MT/s and features 24 PCIe 5.0 lanes for high-speed connectivity.

Network and Slot Connection Information

The Core Ultra 9 285K includes integrated support for Thunderbolt 4, providing two 40 Gbps ports, and has 24 PCIe 5.0 lanes for expansion. It also supports Wi-Fi 6 and can be paired with high-bandwidth devices via PCIe 4.0 lanes.

Detailed Specs

  • Cores/Threads: 24 (8P + 16E) / 24
  • Base Frequency: 3.7 GHz (P-cores), 3.2 GHz (E-cores)
  • Boost Frequency: Up to 5.7 GHz (P-cores), 4.6 GHz (E-cores)
  • Cache: 36 MB L3, 40 MB L2
  • TDP: 125W (base), 250W (max)
  • Memory Support: DDR5-6400
  • Integrated Graphics: Intel Xe-LPG with 4 cores, 2.0 GHz boost

Approximate Cost

The Intel Core Ultra 9 285K is priced around $589.

Reasons to Choose the Core Ultra 9 285K

  1. High Performance: Excellent multi-core performance for demanding applications.
  2. Power Efficiency: Improved power efficiency due to the 3nm process.
  3. Advanced Architecture: Utilizes a chiplet design for better scalability and performance.
  4. Integrated AI Engine: Dedicated AI engine for enhanced AI workloads.
  5. Memory Support: Supports high-speed DDR5 memory.
  6. PCIe 5.0: Offers 24 PCIe 5.0 lanes for high-speed connectivity.
  7. Thunderbolt 4: Integrated support for Thunderbolt 4.
  8. Cooling Efficiency: Lower operating temperatures compared to previous generations.
  9. Future-Proofing: Compatible with the latest technologies and standards.
  10. Versatility: Suitable for both gaming and professional workloads.
  11. Chiplet Architecture: The Core Ultra 9 285K uses a chiplet design, allowing for better scalability and performance by separating different functions into distinct tiles.
  12. 3D Foveros Packaging: This advanced packaging technology stacks multiple layers of silicon, improving performance and efficiency.
  13. Integrated AI Engine: The dedicated AI engine enhances AI workloads, making it suitable for modern applications that leverage AI.
  14. Thunderbolt 4 Integration: Provides high-speed connectivity with two 40 Gbps ports.
  15. Enhanced Memory Support: Supports DDR5-6400 with CUDIMM technology for higher memory overclocking potential.
  16. Improved Cooling Efficiency: Lower operating temperatures due to the advanced 3nm process.
  17. PCIe 5.0 Support: Offers 24 PCIe 5.0 lanes for high-speed connectivity.
  18. Advanced Security Features: Includes Intel’s latest security technologies for enhanced protection.
  19. Power Efficiency: Significant improvements in power efficiency, reducing overall power consumption.
  20. Future-Proofing: Compatible with the latest technologies and standards, ensuring longevity.

Reasons to Consider Alternatives

  1. Gaming Performance: Slightly lower gaming performance compared to previous-gen models.
  2. Compatibility: Requires a new motherboard with LGA 1851 socket.

Competitor Comparisons

  1. AMD Ryzen 9 9950X: The Ryzen 9 9950X offers similar multi-core performance but at a higher price. It excels in productivity tasks and supports AVX-512 instructions, making it a strong competitor for professional workloads.
  2. Intel Core i9-14900K: The previous-gen Core i9-14900K offers better gaming performance and is more affordable. It remains a strong choice for gamers who do not need the latest features.
  3. AMD Ryzen 7 7800X3D: The Ryzen 7 7800X3D is a gaming powerhouse with AMD’s 3D V-Cache technology, offering superior gaming performance at a lower price. However, it lacks the multi-threaded performance of the Core Ultra 9 285K.

Intel Core Ultra 9 (2025)
Intel Core Ultra 9 (2025)

Intel Core Ultra 9 288V Overview

The Intel Core Ultra 9 288V is a high-performance mobile processor from Intel’s Lunar Lake series, designed for lightweight and portable devices. It features a hybrid architecture with 8 cores (4 performance cores and 4 low-power efficient cores) and 8 threads. The performance cores have a base frequency of 3.3 GHz and can boost up to 5.1 GHz, while the efficient cores operate at a base frequency of 3.3 GHz and can boost up to 3.7 GHz.

Hype and Compatibility

The “hype” around the Core Ultra 9 288V is due to its advanced System on a Chip (SoC) architecture, which integrates the CPU, GPU, cache, RAM, and connectivity on a single chip. This design promises significant improvements in power efficiency and performance, making it ideal for ultraportable devices. It is compatible with the FCBGA2833 socket and supports LPDDR5X memory up to 8533 MT/s.

Network and Slot Connection Information

The Core Ultra 9 288V includes integrated support for Thunderbolt 4, providing high-speed connectivity with two 40 Gbps ports. It also supports PCIe 5.0 and 4.0 lanes for expansion, offering flexibility for various high-bandwidth devices.

Detailed Specs

  • Cores/Threads: 8 (4P + 4E) / 8
  • Base Frequency: 3.3 GHz (P-cores), 3.3 GHz (E-cores)
  • Boost Frequency: Up to 5.1 GHz (P-cores), 3.7 GHz (E-cores)
  • Cache: 12 MB L3
  • TDP: 30W (base), 37W (max)
  • Memory Support: LPDDR5X-8533
  • Integrated Graphics: Intel Arc 140V with 8 Xe cores, 2.05 GHz boost

Approximate Cost

The Intel Core Ultra 9 288V is priced around $499.

Reasons to Choose the Core Ultra 9 288V

  1. High Performance: Excellent performance for lightweight and portable devices.
  2. Power Efficiency: Improved power efficiency due to the advanced SoC design.
  3. Integrated AI Engine: Enhanced AI workloads with dedicated AI capabilities.
  4. Memory Support: Supports high-speed LPDDR5X memory.
  5. PCIe 5.0: Offers high-speed connectivity options.
  6. Thunderbolt 4: Integrated support for Thunderbolt 4.
  7. Cooling Efficiency: Lower operating temperatures due to the efficient design.
  8. Future-Proofing: Compatible with the latest technologies and standards.
  9. Versatility: Suitable for both productivity and casual use.
  10. Compact Design: Ideal for ultraportable devices.
  11. SoC Architecture: Integrates CPU, GPU, cache, RAM, and connectivity on a single chip, improving efficiency and performance.
  12. 3D Foveros Packaging: Advanced packaging technology stacks multiple layers of silicon, enhancing performance and efficiency.
  13. Integrated AI Engine: Dedicated AI engine enhances AI workloads, making it suitable for modern applications.
  14. Thunderbolt 4 Integration: Provides high-speed connectivity with two 40 Gbps ports.
  15. Enhanced Memory Support: Supports LPDDR5X-8533 for higher memory speeds.
  16. Improved Cooling Efficiency: Lower operating temperatures due to the efficient design.
  17. PCIe 5.0 Support: Offers high-speed connectivity options.
  18. Advanced Security Features: Includes Intel’s latest security technologies for enhanced protection.
  19. Power Efficiency: Significant improvements in power efficiency, reducing overall power consumption.
  20. Future-Proofing: Compatible with the latest technologies and standards, ensuring longevity.

Reasons to Consider Alternatives

  1. Gaming Performance: Not designed for high-end gaming.
  2. Compatibility: Requires specific motherboard and socket.

Competitor Comparisons

  1. AMD Ryzen 9 7940HS: The Ryzen 9 7940HS offers similar performance but at a higher power consumption. It excels in multi-threaded workloads and supports higher memory speeds, making it a strong competitor for productivity tasks.
  2. Apple M2 Max: The M2 Max offers superior power efficiency and integrated graphics performance. It is a strong choice for creative professionals who need high performance in a portable form factor.
  3. Qualcomm Snapdragon 8cx Gen 4: The Snapdragon 8cx Gen 4 offers excellent power efficiency and integrated 5G connectivity. It is ideal for always-connected PCs and offers competitive performance for everyday tasks.

Intel Core Ultra 9 (2025)
Intel Core Ultra 9 (2025)

Intel Core Ultra 9 185H Overview

The Intel Core Ultra 9 185H is a high-performance mobile processor from Intel’s Meteor Lake series, launched in December 2023. It features a hybrid architecture with 16 cores (6 performance cores and 10 efficient cores) and 22 threads. The performance cores have a base frequency of 3.9 GHz and can boost up to 5.1 GHz, while the efficient cores operate at a base frequency of 1.9 GHz and can boost up to 3.8 GHz.

Hype and Compatibility

The “hype” around the Core Ultra 9 185H is due to its advanced architecture and significant improvements in power efficiency and performance. It uses Intel’s Foveros 3D packaging technology, which stacks multiple chips to enhance performance and efficiency. The processor is compatible with the FCBGA2049 socket and supports DDR5 memory up to 5600 MT/s and LPDDR5x memory up to 7467 MT/s. It also supports PCIe 5.0 for high-speed connectivity.

Network and Slot Connection Information

The Core Ultra 9 185H includes integrated support for Thunderbolt 4, providing high-speed connectivity with two 40 Gbps ports. It also supports PCIe 5.0 and 4.0 lanes for expansion, offering flexibility for various high-bandwidth devices.

Detailed Specs

  • Cores/Threads: 16 (6P + 10E) / 22
  • Base Frequency: 3.9 GHz (P-cores), 1.9 GHz (E-cores)
  • Boost Frequency: Up to 5.1 GHz (P-cores), 3.8 GHz (E-cores)
  • Cache: 24 MB L3, 18 MB L2
  • TDP: 45W (base), 115W (max)
  • Memory Support: DDR5-5600, LPDDR5x-7467
  • Integrated Graphics: Intel Arc Xe-LPG with 128 EUs, 2.35 GHz boost

Approximate Cost

The Intel Core Ultra 9 185H is priced around $640.

Reasons to Choose the Core Ultra 9 185H

  1. High Performance: Excellent multi-core performance for demanding applications.
  2. Power Efficiency: Improved power efficiency due to the advanced architecture.
  3. Integrated AI Engine: Enhanced AI workloads with dedicated AI capabilities.
  4. Memory Support: Supports high-speed DDR5 and LPDDR5x memory.
  5. PCIe 5.0: Offers high-speed connectivity options.
  6. Thunderbolt 4: Integrated support for Thunderbolt 4.
  7. Cooling Efficiency: Lower operating temperatures due to the efficient design.
  8. Future-Proofing: Compatible with the latest technologies and standards.
  9. Versatility: Suitable for both productivity and casual use.
  10. Compact Design: Ideal for ultraportable devices.
  11. SoC Architecture: Integrates CPU, GPU, cache, RAM, and connectivity on a single chip, improving efficiency and performance.
  12. 3D Foveros Packaging: Advanced packaging technology stacks multiple layers of silicon, enhancing performance and efficiency.
  13. Integrated AI Engine: Dedicated AI engine enhances AI workloads, making it suitable for modern applications.
  14. Thunderbolt 4 Integration: Provides high-speed connectivity with two 40 Gbps ports.
  15. Enhanced Memory Support: Supports LPDDR5x-7467 for higher memory speeds.
  16. Improved Cooling Efficiency: Lower operating temperatures due to the efficient design.
  17. PCIe 5.0 Support: Offers high-speed connectivity options.
  18. Advanced Security Features: Includes Intel’s latest security technologies for enhanced protection.
  19. Power Efficiency: Significant improvements in power efficiency, reducing overall power consumption.
  20. Future-Proofing: Compatible with the latest technologies and standards, ensuring longevity.

Reasons to Consider Alternatives

  1. Gaming Performance: Not designed for high-end gaming.
  2. Compatibility: Requires specific motherboard and socket.
  3. Power Consumption: Higher power consumption under full load.

Competitor Comparisons

  1. AMD Ryzen 9 7940HS: The Ryzen 9 7940HS offers similar performance but at a higher power consumption. It excels in multi-threaded workloads and supports higher memory speeds, making it a strong competitor for productivity tasks.
  2. Apple M2 Max: The M2 Max offers superior power efficiency and integrated graphics performance. It is a strong choice for creative professionals who need high performance in a portable form factor.
  3. Qualcomm Snapdragon 8cx Gen 4: The Snapdragon 8cx Gen 4 offers excellent power efficiency and integrated 5G connectivity. It is ideal for always-connected PCs and offers competitive performance for everyday tasks.

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